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Singapore
Recruit Expert Pte Ltd Hiring For System Engineer (Advance Flip Chip Bonder, up to $6,000) at Singapore Full Time
Responsible for Systems & Process Engineering
Participate in the development of hardware and software modules of “Die Bonder” equipment for the semiconductor industry (analysis, modelling, calculation, measurement, qualification).
Develop “Die Bonding” process technologies according to current or future customer requirements (analysis, modelling, calculation, measurement)
Participate in the development of hardware and software modules of “Die Bonder” equipment for the semiconductor industry (analysis, modelling, calculation, measurement, qualification).
Develop “Die Bonding” process technologies according to current or future customer requirements (analysis, modelling, calculation, measurement)
Requirements:
Degree in Microsystem Technology, Mechanical, Electrical or Mechatronic Engineering
At least 3 years of experience in the lab with measurement equipment in semiconductor industry
If you are keen to apply for the position, kindly email your detailed resume in MS Word to [ Email address blocked ]
Please note that only shortlisted candidates will be notified.
For more job opportunities, please visit our website at www.recruit-expert.com
EA Licence: 19C9701
Registration: R1326740
Recommended Skills
- Microsoft Word
- Software Modules
- Measurement And Metrology
- Semiconductor
