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Singapore

Recruit Expert Pte Ltd Hiring For System Engineer (Advance Flip Chip Bonder, up to $6,000) at Singapore Full Time

Responsible for Systems & Process Engineering
Participate in the development of hardware and software modules of “Die Bonder” equipment for the semiconductor industry (analysis, modelling, calculation, measurement, qualification).
Develop “Die Bonding” process technologies according to current or future customer requirements (analysis, modelling, calculation, measurement)

Requirements:

Degree in Microsystem Technology, Mechanical, Electrical or Mechatronic Engineering
At least 3 years of experience in the lab with measurement equipment in semiconductor industry

If you are keen to apply for the position, kindly email your detailed resume in MS Word to [ Email address blocked ]

Please note that only shortlisted candidates will be notified.

For more job opportunities, please visit our website at www.recruit-expert.com

EA Licence: 19C9701

Registration: R1326740

Recommended Skills

  • Microsoft Word
  • Software Modules
  • Measurement And Metrology
  • Semiconductor

Job Overview

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  • Location:
  • Job Title: Recruit Expert Pte Ltd Hiring For System Engineer (Advance Flip Chip Bonder, up to $6,000) at Singapore
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